| Journal Call no. | HC470.3.Z9H53a |
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| Author | Slack, Anthony. |
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| Article Title | Flip-chip-on-glass, advanced electronic packaging for LCDs / Anthony Slack. |
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| Is Part Of | Business & technology information quarterly ; v.3, no.2, Jun 1997, p.36-40, illus. |
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| Abstract | With the reduction that can be made in terms of package size of the final display assembly, and the significant benefits that are readily achieved in terms of assembly cost, chip-on-glass is becoming the preferred technology in a number of existing product areas using LCD displays, and some new areas made possible by the use of flip-chip bonding technology. The paper discusses the technology, applications and developments being made at the Hong Kong University of Science and Technology (HKUST) Technology Transfer Centre. |
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